소재 라이브러리
기존 양산 팹에서 다루기 어려운 특수 박막과 공정 조건 — 산화물·질화물·금속 전반.
PVD — Sputter & Evaporator
산화물
질화물
금속
반도체
ALD
산화물
금속
VO₂ (이산화 바나듐)
Specifications
Thin-Film Specifications
- Film-coated by RF magnetron sputtering vacuum < 1.0 × 10⁻⁶ Torr
- Substrate : Si (100)
- Thickness : 150 nm
- Film Crystallinity : (-402) oriented polycrystals
- RMS Roughness : 6.917 nm
- Resistance ON/OFF ratio : > 1.0 × 10⁴
- Transition temperature : < 60 °C
Target Specifications
- Target Material : Vanadium Dioxide (VO2)
- Purity : 99.99%
- Diameter : 4”
Target V₂O₅ (오산화 바나듐)
상세 자료를 준비 중입니다. 견적 문의는 아래 버튼으로 가능합니다.
TiO₂ (이산화 티타늄)
Specifications
Thin-Film Specifications
- Film-coated by RF magnetron sputtering vacuum < 1.0 × 10⁻⁶ Torr
- Substrate : Si (100)
- Thickness : 150 nm
- Refractive Index (n) : 2.534084 (@ 587 nm) / 2.422304 (@ 1525 nm)
- Extinction Coefficient (k) : 0.000000 (@ 587 nm) / 0.000000 (@ 1525 nm)
Target Specifications
- Target Material : Titanium Dioxide
- Purity : 99.99%
- Diameter : 3”
Target Ta₂O₅ (오산화 탄탈럼)
Specifications
Thin-Film Specifications
- Film-coated by RF magnetron sputtering vacuum < 1.0 × 10⁻⁶ Torr
- Substrate : Si (100)
- Thickness : 132.4 nm
- Film Crystallinity : Broad amorphous peak
- RMS Roughness : 0.291 nm
- Refractive Index (n) : 2.1367 (@ 587 nm) / 2.067869 (@ 1525 nm)
- Extinction Coefficient (k) : 0.000000 (@ 587 nm) / 0.000000 (@ 1525 nm)
Target Specifications
- Material : Tantalum Pentoxide (Ta2O5)
- Purity : 99.95%
- Diameter : 3”
Target HfO₂ (산화 하프늄)
Specifications
Thin-Film Specifications
- Film-coated by RF magnetron sputtering vacuum < 1.0 × 10⁻⁶ Torr
- Substrate : Si (100)
- Thickness : 345.3 nm
- Refractive Index (n) : 2.020440 (@ 587 nm)
- Extinction Coefficient (k) : 0.000000 (@ 587 nm)
Target Specifications
- Target Material : Hafnium Oxide
- Purity : 99.9%
- Diameter : 2”, 3”
Target ZnO (산화 아연)
Specifications
Thin-Film Specifications
- Film-coated by RF magnetron sputtering vacuum < 1.0 × 10⁻⁶ Torr
- Substrate : Si (100)
- Thickness : 85 nm
- Refractive Index (n) : 1.985522 (@ 587 nm)
- Extinction Coefficient (k) : 0.000003 (@ 587 nm)
Target Specifications
- Target Material : Zinc Oxide
- Purity : 99.99%
- Diameter : 2”, 3”
Target ITO (인듐 주석 산화물)
Specifications
Thin-Film Specifications
- Film-coated by RF magnetron sputtering vacuum < 1.0 × 10⁻⁶ Torr
- Substrate : Si (100)
- Thickness : 125 nm
- Sheet resistance : 44 Ω/sq / Resistivity: 5.49E-06 Ω·m
- Transmittance : >90%
- Refractive Index (n) : 1.991928 (@ 587 nm)
- Extinction Coefficient (k) : 0.007197 (@ 587 nm)
Target Specifications
- Target Material : Indium Tin Oxide
- Purity : 99.5%
- Diameter : 3”
Target IGZO (인듐 갈륨 아연 산화물)
상세 자료를 준비 중입니다. 견적 문의는 아래 버튼으로 가능합니다.
Al₂O₃ (산화 알루미늄)
상세 자료를 준비 중입니다. 견적 문의는 아래 버튼으로 가능합니다.
Ga₂O₃ (산화 갈륨)
상세 자료를 준비 중입니다. 견적 문의는 아래 버튼으로 가능합니다.
In₂O₃ (산화 인듐)
상세 자료를 준비 중입니다. 견적 문의는 아래 버튼으로 가능합니다.
NiO (산화 니켈)
Specifications
Thin-Film Specifications
- Film-coated by RF magnetron sputtering vacuum < 1.0 × 10⁻⁶ Torr
- Substrate : Si (100)
- Thickness : 50 nm
- Refractive Index (n) : 2.118204 (@ 587 nm)
- Extinction Coefficient (k) : 0.000000 (@ 587 nm)
Target Specifications
- Target Material : Nickel Oxide
- Purity : 99.99%
- Diameter : 3”
Target SiO₂ (이산화 규소)
Specifications
Thin-Film Specifications
- Film-coated by RF magnetron sputtering vacuum < 1.0 × 10⁻⁶ Torr
- Substrate : Si (100)
- Thickness : 107.6 nm
- Film Crystallinity : Broad amorphous peak
- RMS Roughness : 1.238 nm
- Refractive Index (n) : 1.4567 (@ 587 nm)
- Extinction Coefficient (k) : 0.000000 (@ 587 nm)
Target Specifications
- Target Material : Silicon Dioxide (SiO2)
- Purity : 99.9%
- Diameter : 2”, 3”
Target SnO₂ (이산화 주석)
Specifications
Thin-Film Specifications
- Film-coated by RF magnetron sputtering vacuum < 1.0 × 10⁻⁶ Torr
- Substrate : Si (100)
- Thickness : 141 nm
- Refractive Index (n) : 1.998737 (@ 587 nm)
- Extinction Coefficient (k) : 0.03812 (@ 587 nm)
Target Specifications
- Target Material : Tin Dioxide
- Purity : 99.5%
- Diameter : 3”
Target TiN (질화 티타늄)
Specifications
Thin-Film Specifications
Target Specifications
- Target Material : Titanium Nitride (TiN)
- Purity : 99.99%
- Diameter : 2”
Target AlN (질화 알루미늄)
상세 자료를 준비 중입니다. 견적 문의는 아래 버튼으로 가능합니다.
AlScN (알루미늄 스칸듐 질화물)
Specifications
Thin-Film Specifications
- Film-coated by RF magnetron sputtering vacuum < 1.0 × 10⁻⁶ Torr
- Substrate : Si, Pt
- Leakage current : < 1×10⁻⁸ A
- Remanent polarization : 101.19 µC·cm⁻²
Target Specifications
- AlScN co-sputtering
- Aluminium Nitride (AlN) target — Purity : 99.95% · Diameter : 3”
- Scandium (Sc) target — Purity : 99.99% · Diameter : 3”
Target SiNₓ (질화 규소)
Specifications
Thin-Film Specifications
- Film-coated by RF magnetron sputtering vacuum < 1.0 × 10⁻⁶ Torr
- Substrate : Si (100)
- Thickness : 37.035 nm
- Refractive Index (n) : 2.011712 (@ 587 nm) / 2.061467 (@ 1525 nm)
- Extinction Coefficient (k) : 0.000066 (@ 587 nm) / 0.000000 (@ 1525 nm)
Target Specifications
- Target Material : Silicon Nitride
- Purity : 99.99%
- Diameter : 3”
Target NbN (질화 나이오븀)
상세 자료를 준비 중입니다. 견적 문의는 아래 버튼으로 가능합니다.
NbTiN (나이오븀 티타늄 질화물)
상세 자료를 준비 중입니다. 견적 문의는 아래 버튼으로 가능합니다.
Au (금)
Specifications
Thin-Film Specifications
Target Specifications
- Target Material : Gold (Au)
- Purity : 99.99%
- Diameter : 2”
Target Pt (백금)
Specifications
Thin-Film Specifications
Target Specifications
- Target Material : Platinum (Pt)
- Purity : 99.95%
- Diameter : 2”
Target Al (알루미늄)
상세 자료를 준비 중입니다. 견적 문의는 아래 버튼으로 가능합니다.
Ti (티타늄)
Specifications
Thin-Film Specifications
Target Specifications
- Target Material : Titanium (Ti)
- Purity : 99.99%
- Diameter : 2”, 3”
Target Cr (크로뮴)
Specifications
Thin-Film Specifications
Target Specifications
- Target Material : Chromium (Cr)
- Purity : 99.95%
- Diameter : 3”
Target Ni (니켈)
상세 자료를 준비 중입니다. 견적 문의는 아래 버튼으로 가능합니다.
Bi (비스무트)
상세 자료를 준비 중입니다. 견적 문의는 아래 버튼으로 가능합니다.
Mo (몰리브데넘)
Specifications
Thin-Film Specifications
Target Specifications
- Target Material : Molybdenum (Mo)
- Purity : 99.95%
- Diameter : 2”
Target Hf (하프늄)
Specifications
Thin-Film Specifications
Target Specifications
- Target Material : Hafnium (Hf)
- Purity : 99.95%
- Diameter : 2”
Target Sc (스칸듐)
Specifications
Thin-Film Specifications
Target Specifications
- Target Material : Scandium (Sc)
- Purity : 99.99%
- Diameter : 3”
Target W (텅스텐)
Specifications
Thin-Film Specifications
Target Specifications
- Target Material : Tungsten (W)
- Purity : 99.95%
- Diameter : 2”
Target Pd (팔라듐)
Specifications
Thin-Film Specifications
Target Specifications
- Target Material : Palladium (Pd)
- Purity : 99.99%
- Diameter : 2”
Target Rh (로듐)
Specifications
Thin-Film Specifications
Target Specifications
- Target Material : Rhodium (Rh)
- Purity : 99.99%
- Diameter : 2”
Target Te (텔루륨)
상세 자료를 준비 중입니다. 견적 문의는 아래 버튼으로 가능합니다.
Si (실리콘)
Specifications
Thin-Film Specifications
- Film-coated by RF magnetron sputtering vacuum < 1.0 × 10⁻⁶ Torr
- Substrate : Si (100)
- Thickness : 250 nm
- Refractive Index (n) : 4.594714 (@ 587 nm) / 3.727408 (@ 1525 nm)
- Extinction Coefficient (k) : 0.596195 (@ 587 nm) / 0.000000 (@ 1525 nm)
Target Specifications
- Target Material : Silicon (Si)
- Purity : 99.9%
- Diameter : 2”, 3”
Target Al₂O₃ (산화 알루미늄)
Specifications
Thin-Film Specifications
- Film-coated by thermal ALD process vacuum < 1.0 × 10⁻2 Torr
- Substrate : Si (100)
- Breakdown field : > 7 MV/cm
- Dielectric constant (ε) : > 7
- Refractive Index (n) : 1.666831(@ 587 nm)
- Extinction Coefficient (k) : 0.000000(@ 587 nm)
- Growth per cycle (GPC) : 1.1 Å/cycle
Process Specifications
- Precursor : TMA(Trimethylaluminium)
- Reactant : H2O, O3
- Process Capability : 6-inch, 12-inch
- Temperature Window : 150 ~ 250 °C
- Applications : Gate Dielectric, Surface Passivation, Conformal Dielectric Coating
HfO₂ (산화 하프늄)
Specifications
Thin-Film Specifications
- Film-coated by thermal ALD process vacuum < 1.0 × 10⁻2 Torr
- Substrate : Si (100)
- Breakdown field : > 5 MV/cm
- Dielectric constant (ε) : > 20
- Refractive Index (n) : 2.012921(@ 587 nm)
- Extinction Coefficient (k) : 0.000000(@ 587 nm)
- Growth per cycle (GPC) : 1.0 Å/cycle
Process Specifications
- Precursor : TDMAH(Tetrakis(dimethylamino)hafnium(IV))
- Reactant : H2O, O3
- Process Capability : 6-inch, 12-inch
- Temperature Window : 200 ~ 250 °C
- Applications : High-k Gate Dielectric, Capacitor Dielectric, Interfacial Layer
TiO₂ (이산화 티타늄)
Specifications
Thin-Film Specifications
- Film-coated by thermal ALD process vacuum < 1.0 × 10⁻2 Torr
- Substrate : Si (100)
- Refractive Index (n) : 2.339362(@ 587 nm)
- Extinction Coefficient (k) : 0.004537(@ 587 nm)
- Growth Per Cycle (GPC) : TTIP 0.3 Å/cycle / TDMAT 0.5 Å/cycle
Process Specifications
- Precursor : TTIP(Titanium isopropoxide), TDMAT(Tetrakis(dimethylamido)titanium(IV))
- Reactant : H2O, O3
- Process Capability : 6-inch, 12-inch
- Temperature Window : 100 ~ 250 °C
- Applications : Optical Coating, Photocatalytic Coating, High-k Dielectric